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Master Bond Polymer System EP30HT-1 Product Description

 

MASTER BOND POLYMER SYSTEM EP30HT-1
Two component low viscosity epoxy resin system featuring outstanding
thermal stability and superior chemical resistance properties

Master Bond Polymer System EP30HT-1 is a two component, low viscosity epoxy resin system which features excellent mechanical strength properties, superior chemical resistance and remarkably high heat distortion temperatures. Other desirable properties include light color and fast cures at a wide range of temperatures. For maximum performance a heat cure at moderately elevated temperatures is required. Master Bond Polymer System EP30HT-1 is recommended for coating, pot-ting, encapsulation, adhesive, laminating, filament winding and RR1M/RIM applications.

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