Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more quickly at elevated temperatures. EP30LTE represents the long desired technical breakthrough of a significant reduction in the high thermal expansion coefficients characteristic of epoxies and all other organic polymers while retaining their advantageous properties and ease of processability. Master Bond EP30LTE is formulated with a unique blend of polymeric and inorganic materials to obtain thermal expansion coefficients as low as 12x10^-6 in/in°C as well as unmatched dimensional stability, making possible new standards of performance for bonding, coating, sealing, and casting. Shrinkage upon cure is truly exceptionally low-less than 0.0002 in/in. Thermal shock resistance is excellent.

The Master Bond EP30LTE Polymer System cures to a high strength solid which features unexcelled resistance to thermal cycling over the temperature range of -60°F to +250°F. It is 100% reactive and does not contain any solvents or diluents. The cured material is an excellent electrical insulator and has superior chemical resistance to many chemicals including water, fuels, many organic solvents as well as diverse acids, bases and salts. It produces high strength durable bonds to many similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers, and most plastics. Master Bond Polymer System EP30LTE is setting new quality and performance standards in the electronic, electrical, computer, construction, metalworking, optical, automotive, aerospace and chemical industries.

A NASA approved low outgassing version called EP30LTE-LO is now available, featuring the same outstanding physical properties as the regular EP30LTE, except the viscosity is around 30,000 cps.