Master Bond Polymer System EP30LTC is a two component epoxy adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient 100/15 mix ratio by weight. This compound is 100% reactive paste and does not contain any solvents or other volatiles. It is especially recommended where adhesive bonds require a low thermal expansion coefficient and bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low-0.0003 inch/in.

Master Bond EP30LTEC produces high strength bonds with excellent resistance to thermal cycling and many chemicals includ-ing water, oil, fuels and most organic solvents over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. Color of part A is off-white opaque, part B slightly yellow. Master Bond Polymer Adhesive EP30LTEC is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.