Master Bond Polymer System EP32 is a low viscosity, highly flexibe, two component epoxy resin based polymer system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to three (3) mix ratio by weight. This compound is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application, and where the pottings, castings and encapsulations must withstand mechanical shock, vibration or thermal cycling without cracking. Shrinkage after cure is exceptionally low. The EP32 compound does not contain any urethanes or isocyante moities and is considered non hazardous by DOT regulations.

Master Bond Polymer System EP32 produces high strength and tough flexible castings, bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the temperature range of -80°F to more than 250°F, making it suitable for a wide range of applications. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened compound is an electrical insulator. Color of part A is clear, part B tan. Master Bond Polymer System EP32 is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.