Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). Master Bond Polymer System EP34 is a high performance potting, encapsu-lating, and adhesive compound whose strength is maintained even after long exposures to temper-atures in the 400-450°F range. Unlike many other epoxy resin systems its performance is relatively insensitive to mixing ratio or substrate cleaning procedure. Master Bond Polymer System EP34 is easily mixed and can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents. A lower viscosity version with equivalent performance properties is available if desired.

Master Bond Polymer System EP34 offers outstanding durability, toughness and high physical strengths. The cured epoxy resin compound is remarkably resistant to repeated severe thermal cy-clying and chemicals including water, oil and mdst organic solvents over the exceptionally wide temperature range of - 60°F to 450°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened epoxy is a superior electrical insulator. Color of part A gray, part B amber. Master Bond Polymer System EP34 offers the convenience of a room temperature cure with high temperature performance and is widely used in the electronic, electri-cal, computer, construction, metalworking, appliance, automotive and chemical industries.

The cured resin system fully meets the requirements of MIL-MMM-A-132.