EP36AO Product Description

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

Master Bond EP36AO is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring thermal conductivity, electrical insulation and high temperature resistance. It differs greatly from other heat resistant epoxies as it has far more toughness and flexibility. Its forgiving nature at high temperatures imparts vastly superior thermal and mechanical shock resistance as well as superb thermal cycling ability when compared to more standard high temperature resistant epoxies. EP36AO bonds well to a variety of substrates including metals, glass and many plastics. It has good chemical resistance to water, acids, bases, fuels and oils. This one component system is primarily used for potting but can also be used for bonding and sealing. The service temperature range is -100°F to +500°F. Master Bond EP36AO offers the additional convenience of being a one component system together with flexible cure schedules.

EP36AO has a unique chemistry which allows the product to be both tough and heat resistant without sacrificing mechanical, electrical, or thermal properties. For example at 100°C, EP36AO has a Shore D hardness of 25-30 and yet maintains its integrity and dimensional stability. This lower hardness is indicative of its toughness and flexibility and translates into its enhanced ability to withstand rigorous thermal cycling. These properties—mechanical, thermal and electrical—are sustainable up to 500°F, and as a consequence EP36AO is particularly well suited for potting and encapsulation applications where thermal conductivity, electrical isolation and the ability to withstand severe thermal cycling over a wide temperature range are needed.

While EP36AO is an unconventional epoxy, it is conveniently available in 30 gram cookies as well as pints and quarts. This system is formulated at elevated temperatures and poured into cans or 30 gram cookie molds and solidifies. Since it is a solid; it must be heated in a forced air or convection oven at 150-180°F to transform it to a liquid. As a liquid, it is easy to apply as an encapsulant or an adhesive. To complete the cure, the temperature should be 350°F for 2-3 hours. EP36AO will retain its liquidity as long as the temperature does not exceed 180°F. Liquefied but uncured material can be reused by allowing EP36AO to resolidify at room temperature. Cured material cannot reliquefy; resolidified materials can become liquid again. This epoxy is amber in color. EP36AO is a specialty system that is primarily used in electronic and aerospace applications.

Product Advantages

  • One component system.
  • Superb thermal conductivity and electrical insulation properties.
  • Combines flexibility and toughness with high temperature resistance.
  • Ideal for potting and encapsulation.
  • Unused material is easy to reprocess.
  • Available in conveniently prepared 30 gram cookies.
  • Capable of withstanding rigorous thermal cycling and thermal shocks.

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