EP36AO Product Description

Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, coatings and bonding applications. It features an outstanding combination of properties including high temperature stability up to 500°F, outstanding thermal shock resistance and high thermal conductivity over the exceptionally wide temperature range of -80°F to +500°F, superior mechanical properties, excellent adhesion to both metallic and nonmetallic substrates, a high degree of chemical resistance plus remarkably good electrical insulation characteristics. Master Bond Polymer System EP36AO offers the additional application convenience of a one component system together with flexible cure schedules as to best meet specific processing requirements.