Master Bond Polymer System EP37-3FLFAOSP-1 is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. It has an unusual blend of properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAOSP-1 has low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy. EP37-3FLFAOSP-1 is also an excellent adhesive/sealant forming tough bonds that are resistant to shock, impact and thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of 4K to 250°F. Parts A and B are off white in color. Master Bond EP37-3FLFAOSP-1 is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and heat transfer are required. The uniqueness of EP37-3FLFAOSP-1 lies in the fact that this thermally conductive system retains a high level of flexibility while having the desirable physical characteristics inherent in epoxies.