Master Bond Polymer System EP37-3FLSP is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. It bonds well to a wide variety of substrates including metals, glass, ceramics, rubber and many plastics.

EP37-3FLSP is a superb potting, encapsulating and casting system. Its low exotherm makes it an ideal material for large castings. In this regard it also possesses superior electrical insulation properties. The combination of high flexibility and low exotherm helps prevent EP37-3FLSP from stressing sensitive electronic components during cure. Also noteworthy is the exceptionally long working life which, depending upon mass, could offer beyond 12 hours at room temperature conditions. EP37-3FLSP is serviceable from 4K to +200°F. This versatile system is widely used in optical, electronic, electrical, computer and OEM type applications.