Master Bond Polymer System EP39-M is a low viscosity, two component, epoxy adhesive/sealant for high performance bonding featuring excellent electrical insulation characteristics, high thermal stability and superior chemical resistance. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a convenient one (1) to one (1) mix ratio by weight. The Master Bond Polymer System EP39-M is 100% reactive and does not contain any solvents or other volatiles. Shrinkage after cure is exceptionally low,0.0005 to 0.0003 in/inch depending upon the curing conditions employed. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit excellent electrical insulation characteristics, even upon exposure to adverse environmental conditions at both ambient and elevated temperatures in the presence of water and other chemicals as well as durable high bonding strengths.

Master Bond Polymer System EP39-M is based on a novel polyfunctional epoxy resin and a uniquely modified cycloaliphatic polyamine hardener. It produces high strength and tough bonds with exceptional

electrical insulation characteristics which bonds are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than 350°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, cement, wood vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant maintains its electricai insulating properties at elevated temperature in the presence of moisture. Color coding makes mixing easy: color of part A is black, part B light yellow. Master Bond Polymer System EP39-M is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It has proven particularly successful for sealing and bonding capacitors as well as in many other electronic/electrical applications.