Master Bond Polymer System EP3FL is a superior one component epoxy resin system for high performance bonding as well as for potting and encapsulation of sensitive electronic components which are expected to withstand severe environmental conditions in service. Its flexibility and toughness permit it to adjust to both thermal and mechanical stresses without damaging such components. EP3FL combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical insulation characteristics. It has a service temperature range from -100°F to + 250°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP3FL offers the application convenience of a one component epoxy system which does not require any mixing before use. Although it requires an elevated temperature cure, schedules are flexible to meet specific application requirements. It is 100% reactive and does not contain solvents or diluents.

Master Bond Polymer System EP3FL is supplied in a yellow/ brown colored high viscosity liquid having a minimum storage stability of 3 months when stored at temperatures at 75°F. Refrigeration at 40/50° extends the storage stability of this epoxy to 4 months. Gel times and cure schedules depend upon temperature, a typical gel time at 300°F is approximately 90-100 seconds. The cure time at 300°F is approximately 10^-15 minutes and at 250°F approximately 25-35 minutes.