Master Bond Polymer System EP3HTFL is a new superior and cost effective flexibilized one component epoxy resin system for high performance electrical potting, encapsulation and bonding which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with superior electrical insulation properties. It has a service temperature range from -60°C to +175°C. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP3HTFL offers the application convenience of a storage plus remarkable fast flexible cure schedules so as to best meet specific application requirements. This product is proving particularly effective for underfill applications. It is 100% reactive and does not contain solvents or diluents. All ingredients are TOSCA listed.

Master Bond Polymer System EP3HTFL is available as a brown colored medium viscosity liquid or any desired color including gray, black, red, green etc. The gel time at 300°F is in the order of 90-100 seconds. The cure time at 300°F is around 10^-15 minutes. At 250°F gel times are somewhat longer and cures can be obtained within 25-35 minutes. Master Bond Polymer System EP3HTFL has a minimum storage stability at ambient temperatures of more than three months. Refrigeration greatly extends its storage stability. This product is particularly advantageous where severe environmental conditions must be resisted in services. Its flexibility and toughness permit it to successfully withstand repeated severe thermal and mechanical stresses without impairment of performance characteristics.