Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good thermal shock and heat resistance, as well as superior protection against water and chemicals including many solvents and cleaning agents. It also has excellent electrical insulation properties. EP3RRLV has a broad service temperature range of -80°F to +300°F. It adheres well to metals, ceramics, glass and most plastics. As a one part system, it requires no mixing and has an unlimited working life at room temperature. EP3RRLV is 100% reactive and does not contain any solvents or volatiles. Its shelf life at 75°F is 3 months and at 40°F is 6 months.

EP3RRLV features versatile curing schedules with a 30-35 minute cure at temperatures as low as 220°F-250°F and a 10^-15 minute cure at 300°F. The color of EP3RRLV is light yellow, other colors are available upon request. EP3RRLV has excellent resistance to thermal cycling as well as mechanical vibration and shock. The system has excellent flowability and is a superb material for potting, encapsulation and casting. A most remarkable property is that EP3RRLV can be cast in thicknesses up to an inch, a highly unusual property for a one component system. The combination of rapid curing, no mixing and flowablilty makes EP3RRLV a highly effective underfill epoxy. EP3RRLV is widely used for microelectronics assembly and packaging applications, especially where good physical properties, convenient handling and fast curing are required. EP3RRLV is now available in syringes for manual or automatic dispensing.