Master Bond Polymer System EP40 is newly developed two component highly flexible epoxy compound for high performance bonding, potting, encapsulation, and sealing with outstanding shear and peel strength. It features excellent adhesion to engineering plastics as well as metals and various other substrates. It is formulated to cure readily at ambient temperatures or more quickly at elevated temperatures with a convenient noncritical one (1) to one (1) mix ratio, by weight or volume. This compound is 100% reactive and does not contain any volatiles. Master Bond Polymer System EP40 has proven to be highly effective for applications requiring the inherently desirable physical strength properties of epoxy resins along with high flexibility and peel characteristics. EP40 has superb resistance to thermal cycling as well as mechanical shocks and vibration. The shrinkage after cure is remarkably low (less than 0.1%). Electrical insulation of the cured compound exceeds 10¹² ohm-cm.

Master Bond Polymer System EP40 forms high performance flexible bonds, seals and castings that offer excellent retention of physical, electrical and chemical properties even after prolonged exposure to unfavorable environmental conditions. The service temperature range is from -100 to +235°F. It is a desirable encapsulant and potting epoxy where rigorous thermal cycling and/or a intense mechanical shock environment exists. Most noteworthy is its high shear and peel strength as well as its superb adhesion to most substrates, especially to polycarbonates and acrylics. Its normal color is amber but other colors are available. A non drip version called EP40ND is also available. EP40 can be used for a wide variety of applications including aerospace, electronic, electrical, medical, optical and automotive.