Master Bond Polymer System, MB525, is a high performance epoxy hot melt compound designed to provide excellent adhesion to metals, glass, wood and other substrates. It exhibits a comparatively low softening point of 190-220°F, low viscosity at 300°F and low peel values. Bond strength develops rapidly and is maintained over a wide temperature range (-25°F to +130°F). Recommended application temperature is 230°F to 260°F. for optimal results, surfaces to be bonded should be free of dirt, oil and grease.