Master Bond Polymer System MB544 is a novel high performance polyamide hot melt for fast cost effective bonding, potting and encapsulation. This unique material is readily processed by melting it to the 325-375°F range. The molten product features excellent adhesion to many different substrates including many hard to bond substrates. It can also be easily cast and features excellent toughness as well as superior electrical insulation properties for potting and encapsulation applications. Its long open time is proving particularly desirable for larger castings and pottings. Specific processing advantages include high productivity, superior toughness, elimination of the often labor intensive mixing operations involved in the bonding and casting of conventional two component adhesives and potting compounds and excellent thermal shock resistance. Furthermore, Master Bond Polymer Systems MB544 is 100% reactive and does not contain any solvents or other volatiles. The product meets the requirements of the Code of Federal Regulations, Title 21, Section 175.105.