Master Bond Polymer System 340 is a non-curing grease-like thermally conductive silicone compound with a polydimethylsiloxane paste and a quantity of a special inert filler. It is extremely stable, will not dry, cure or bleed even after exposure to temperatures as high as 200°C (392°F) and more. Master Sil 340 is employed as a heat transfer compound between electronic components, thus increasingly assembly efficiency and in mounting of transistors, diodes etc. The compound conforms to MIL-C-47113A specifications, also MIL-C-47009(MI).