Supreme 10HTFN Product Description

Master Bond Polymer System Supreme 10HTFN "snap cure" epoxy is a specially formulated system featuring a combination of high performance properties including high shear and peel strength, good electrical conductivity, exceptionally easy processing along with a very rapid "snap cure". This one component, no mix, nickel conductive system is formulated to cure at elevated temperatures in as little as 2 minutes at 380400°F. Typical cure schedule is 5-10 minutes at 300°F. Minimum curing temperature is 250°F with a cure cycle of 20-30 minutes. Tensile shear strengths in excess of 1200 psi and Tpeel strengths in excess of 5 pli are readily obtained. Supreme 10HTFN has a wide service temperature range of 4K to 400°F. It also offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Supreme 10HTFN can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents although it can be made flowable by adding 5 to 10% of an appropriate solvent such as, xylene or acetone by weight.

Supreme 10HTFN forms tough, electrically conductive bonds that are resistant to many chemicals including water, oil, fuels and most organic solvents. The electrical conductivity is fully retained even upon severe thermal cycling. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is superb. The cured system is also a superior thermal conductor. Supreme 10HTFN offers the convenience of no mixing prior to use combined with an unlimited working life before implementing the heat cure. It is widely used in applications for aerospace, electrical, computer, appliance, automotive and particularly electronic industries where high performance, rapid cures and cost effectiveness are required.