Useful Criteria for Adhesive Selection

Physical Strength Properties

Master Bond Inc. has developed a wide variety of adhesives with a range of physical strength requirements designed to best meet specific application needs. High strength structural adhesives are available for metal to metal bonding uses subjected to high stresses under hostile environmental conditions. Toughened structural adhesive systems are available for uses where thermal cycling and/or severe mechanical vibration stresses are encountered. Special formulations are offered for bonding materials with widely different thermal expansion coefficients such as glass to metal or plastic to ceramics. Compositions can be designed to optimize shear strength, peel strength, fatigue resistance etc. as desired. Many Master Bond formulations meet or exceed applicable MIL specifications for high performance structural adhesives.

Chemical Resistance

Master Bond Inc. has successfully formulated adhesive compositions with outstanding chemical resistance. Specifically, adhesives are available which can withstand even prolonged exposures to water, inorganic acids and salts, alkalis and many aggressive organic solvents. They successfully resist such chemical exposures to both liquids and vapors at ambient and elevated temperatures without degradation of bond strength. A prime example is the availability of adhesives which can resist exposure to 78% sulfuric acid. Moreover such adhesives do not corrode metals and other substrates.

High Temperature Resistance

High temperature resistance has proven to be a difficult problem for many commercially available adhesive systems. Master Bond Inc. research and development has provided practical innovative adhesive products for exposure to temperatures up to 600°F and above. Both one and two component adhesives are offered capable of prolonged service under such hostile environmental conditions. They include both rigid and flexible compositions. Typical of Master Bond's successful development in this area is a one component structural adhesive suitable for service from more than 400°F to liquid helium. This particular grade is a NASA listed non-outgassing toughened epoxy based system.

Electrical Insulation

A line of adhesives has been specifically formulated to offer outstanding electrical insulation properties over a wide temperature range. Formulations are available which exhibit superior electrical insulation from more than 500°F to cryogenic conditions. They have been so designed that bonding strengths are not affected by exposure to moisture and many other chemicals including organic solvents. Certain compositions offer outstanding electrical resistivities, low dissipation factors, dielectric constant and arc resistance. These compounds are equally useful in sealing and potting applications.