What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.
The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands.
Advanced power and high frequency communications electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives.
Die attach adhesives serve a vital role in semi-conductor assembly, manufacturing and throughout the product life cycle. In this white paper, learn how they facilitate assembly and about the application process. Find out why thin bond lines are so important for product life cycle.
The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, and other physical damage.