News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part Epoxy Offers Exceptionally High Tensile Strength Release Date: 02/23/2012 Product: EP15 Primarily used for testing the adhesion or cohesive strength of flame sprayed coatings as per the ASTM C633 specification, Master Bond EP15 produces high strength bonds across a wide variety of applications. This one component epoxy bonds well to many similar and dissimilar substrates. Particularly noteworthy is its adhesion to… Read More...
	New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved Release Date: 01/12/2012 Product: EP3HTSMed Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMed epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications. This silver-filled epoxy adhesive/… Read More...
	High Performance, UV Curable Epoxy with Enhanced Chemical Resistance Release Date: 11/17/2011 Product: UV16 Combining superior physical strength and fast cure rates, Master Bond UV16 is formulated for demanding bonding, sealing, and coating applications. It is a one component, no mix system and cures in one minute or less at room temperature with commercial UV light sources. This 100% reactive epoxy is uninhibited by oxygen… Read More...
	Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization Release Date: 07/14/2011 Product: EP42HT-2ND2Med Black Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2Med Black fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants. EP42HT… Read More...
	Silver Conductive Epoxy Meets NASA Low Outgassing Standards Release Date: 06/17/2011 Product: EP21TDCS-LO Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cures at room temperature in 24-48 hours… Read More...