News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance Release Date: 11/27/2017 Product: MasterSil 151TC Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features a thermal conductivity of 10-12 BTU•in/ft²•hr•°F [1.44-1.73 W/(m•K)] and superior electrical insulation properties. Volume resistivity i… Read More...
	Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity Release Date: 10/30/2017 Product: EP3HTSDA-1 Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft²•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach… Read More...
	Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life Release Date: 10/09/2017 Product: EP110F8-5 Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 10¹⁵ ohm-cm, a dielectric constant of 2.91 at 1 KHz and a… Read More...
	One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion Release Date: 09/18/2017 Product: EP13LTE Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of… Read More...
	High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications Release Date: 08/28/2017 Product: EP17HTDA-1 Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (T_g) and also… Read More...