News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Component Epoxy Adhesive Has Ultra Low Thermal Resistance and Meets NASA Low Outgassing Specifications Release Date: 01/11/2016 Product: Supreme 18TC Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10^-6 K•m²/W and a thermal conductivity of… Read More...
	Toughened, Room Temperature Curing Epoxy Offers A Long Working Life Release Date: 12/14/2015 Product: Supreme 11HTLP Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive… Read More...
	Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications Release Date: 11/23/2015 Product: MasterSil 972TC-LO Master Bond MasterSil 972TC-LO passes the rigorous requirements for low outgassing per ASTM E595 specifications. It is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This two part silicone system offers convenient… Read More...
	One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications Release Date: 11/02/2015 Product: UV15DC80Med Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. This kind of UV system is highly desirable because it allows for rapid fixturing with… Read More...
	High Temperature Resistant, One Component Epoxy Cures at 200-220°F Release Date: 10/13/2015 Product: EP17HT-100 Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive… Read More...