News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Optically Clear, Low Viscosity, High Strength Two Part Epoxy System Release Date: 06/19/2013 Product: EP30HV Master Bond EP30HV, a two component epoxy, features wide applicability in the electronic, electrical, computer, aerospace, automotive, optical, fiber optic, medical and chemical industries. Formulated for bonding, sealing, coating and casting applications where high strength and optical clarity are needed, it complies with FDA… Read More...
	New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding Release Date: 05/28/2013 Product: MB600S Master Bond MB600S is an aqueous based sodium silicate formulated for coating applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. The energy emitted from various sources, including radios and appliances, can interfere with other electronic devices. Conductive… Read More...
	Addition Cured Silicone Meets USP Class VI and ISO 10993-5 Specifications for Biocompatibility and Cytoxicity Release Date: 05/14/2013 Product: MasterSil 153Med Formulated for medical device applications, MasterSil 153Med passes USP Class VI and ISO 10993-5 testing. This two part silicone with a paste consistency features a convenient one to one mix ratio by weight, and does not require exposure to air and humidity for cross-linking. It has a long working life of 5-7 hours and will not… Read More...
	Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy Release Date: 05/01/2013 Product: EP21FRNS-2 Featuring a non-halogen filler, Master Bond EP21FRNS-2 passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. It produces very low smoke levels and is well suited for the computer, aerospace and related industries. This two part epoxy features a convenient one to one mix ratio… Read More...
	High Temperature Resistant B-Staged Adhesive Film Features Thermal Conductivity and Electrical Insulation Release Date: 04/09/2013 Product: FLM36 In an effort to mitigate the more complicated preparation associated with B-staged epoxies, Master Bond developed FLM36 for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This B-staged film eliminates mixing and measuring and is easy to handle. FLM36 can… Read More...