EP3AOHT

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One Component Abrasion, Thermal Shock and Heat Resistant Thermally Conductive Epoxy for Electrical Potting Encapsulation and Bonding

Typical Properties
Viscosity
paste
Cure Schedule
10-15 minutes at 150°C, 20-25 minutes at 125°C
Service Temperature Range
-60°F up to 400°F
Dielectric Constant
4.1 at 75°F, 60 cycles; 3.9 at 75°F, 106 cycles
Dielectric Strength
450 volts/mil (0.32 cm thick test specimen)
Dissipation Factor
0.013
Glass Transition Temperature (Tg)
115°C
Thermal Conductivity
10 BTU•in/(ft²•hr•°F)
Volume Resistivity
<10¹⁵ ohm/cm, 25°C
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EP3AOHT One Part Epoxy
Product Description

Master Bond Polymer System EP3AOHT is a new superior and cost effective epoxy resin system for electrical potting, encapsulation, and bonding. It combines high physical strength, including resistance to abrasion, thermal shock and heat. It has good thermal conductivity, is inert to water and chemicals, with good electrical insulation characteristics. It has a service temperature range from - 60°F up to 400°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP3AOHT offers the application convenience of a one component epoxy system which eliminates mixing and provides flexible cure schedules to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents.

Master Bond Polymer System EP3AOHT is supplied in the form of a light gray paste having a minimum storage stability of more than 3 months when stored at room temperature. Refrigeration greatly extends the storage stability of this epoxy to 6 months. Gel time and cure schedules depend on temperature. The gel time at 150°C is in the order of 90-100 seconds. The recommended cure time at 150°C is in the order of 10-15 minutes and at 125°C in the order of 20-25 minutes.

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How to order

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