Product Selector

Filters
Applications
Product Type
Product Type
Certifications
Thermal Conductivity
Product Certifications Applications Viscosity Cure Schedule Hardness Temp. Range Link to Content
EP35SP Epoxy System
EP35SP
Two component epoxy system for bonding, sealing and coating applications
Glass Transition Temperature (Tg)
215-220°C
Tensile Lap Shear Strength
2,200-2,400 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
paste 1 hour at 110°C, followed by 2 to 3 hours at 125-150°C, with a post cure at 175°C for 2 to 3 hours 85-95 Shore D -80°F to +550°F /de/tds/ep35sp
EP37-3FLF Two Component Epoxy System
EP37-3FLF
Two component, room temperature curing epoxy for bonding, casting and coating
Acoustical Impedance
2.5 MRayl
Refractive Index
1.536
  • RoHS Compliant
  • Bonding
  • Coating
  • Casting
  • Encapsulation
  • Sealing
  • Gap Filling
600-1,200 cps overnight at 75°F, followed by a post cure at 135-165°F for 3-5 hours 25-35 Shore D 4K to +250°F /de/tds/ep37-3flf
EP37-3FLFAO Two Part Epoxy
EP37-3FLFAO
Two component epoxy compound for potting, bonding, sealing and coating
Dielectric Strength
450 volts/mil
Tensile Modulus
30,000-40,000 psi
  • NASA Low Outgassing
  • 1,000 Hours at 85°C/85% RH
  • RoHS Compliant
  • MIL-STD-810G for Fungus Resistance
  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation
  • Gap Filling
Part A: 6,000-11,000 cps, Part B: 7,000-12,000 cps 75°F: 48-72 hours; 200°F: 2-3 hours; Optimal cure: Overnight at 75°F followed by post cure at 135-165°F for 3-5 hours 35-45 Shore D 4K to +250°F /de/tds/ep37-3flfao
Two Part Epoxy EP37-3FLFAOND
EP37-3FLFAOND
Two component epoxy compound for bonding, sealing and encapsulation
Dielectric Constant
4.9
Tensile Modulus
30,000-40,000 psi
  • NASA Low Outgassing
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: paste, Part B: paste 75°F: 2-3 days; 150-200°F: 2-4 hours 35-45 Shore D 4K to +250°F /de/tds/ep37-3flfaond
EP38CL Two Component Epoxy System
EP38CL
Two component high performance epoxy for bonding, sealing, coating and encapsulation
Tensile Modulus
300,000-350,000 psi
Volume Resistivity
>10¹⁴ ohm-cm
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
1,000-4,000 cps 75°F for 24-48 hours, 200°F for 1-2 hours 75-85 Shore D -100°F to +250°F /de/tds/ep38cl
EP39-2 Two Part Epoxy
EP39-2
Two component, low viscosity, room temperature curing epoxy for bonding, sealing, coating and casting
Dielectric Constant
4.3
Refractive Index
1.55
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Casting
  • Gap Filling
  • Encapsulation
  • Potting
2,000-4,000 cps 3-4 hours at ambient temperatures followed by 2-3 hours at 140-170°F 75-85 Shore D -60°F to +300°F /de/tds/ep39-2
EP39MAOHT Two Part Epoxy System
EP39MAOHT
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system
Dielectric Constant
4.8
Tensile Lap Shear Strength
1,400-1,600 psi
  • MIL-STD-810G for Fungus Resistance
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Potting
  • Casting
  • Gap Filling
3,000-6,000 cps 75°F: 3-5 days; 150-200°F: 3-4 hours; optimum cure schedule: overnight at 75°F plus 3-5 hours at 150-200°F 80-90 Shore D -100°F to +400°F /tds/ep39maoht
EP39MHT Two Part Epoxy System
EP39MHT
Two component, low viscosity, room temperature curing epoxy resin system
Elongation
70-90%
Volume Resistivity
>10¹⁴ ohm-cm
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Potting
  • Casting
  • Gap Filling
1,500-3,000 cps 75°F in 3-4 days; accelerated by heat curing for 3-4 hours at 150-200°F; optimum cure schedule overnight at 75°F followed by 2-4 hours at 150-200°F. 75-85 Shore D -100°F to +400°F /de/tds/ep39mht
Two Part Epoxy EP40
EP40
Two component, room temperature curing epoxy system with good toughness; meets NASA low outgassing specifications
Dielectric Constant
4.1
Elongation
80-90%
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 9,000-16,000 cps, Part B: 6,000-8,000 cps overnight at 75°F followed by 2-3 hours at 120°F to 150°F 50-60 Shore D -100°F to +250°F /de/tds/ep40
EP40Med Two Part Epoxy
EP40Med
Two component, room temperature curing epoxy with high elongation
Dielectric Constant
4.1
Elongation
80-90%
  • ISO 10993-5 for Cytotoxicity
  • RoHS Compliant
  • USP Class VI Medical
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Gap Filling
Part A: 9,000-16,000 cps, Part B: 6,000-8,000 cps overnight at 75°F followed by 2-3 hours at 120°F to 150°F 50-60 Shore D -80°F to +250°F /de/tds/ep40med

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).