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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP77M-1 Two component, silver conductive epoxy adhesive system Thermal Conductivity 20-22 BTU•in/(ft²•hr•°F)[2.88-3.17 W/(m•K)] Volume Resistivity <10⁻³ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: >400,000 cps, Part B: 10-35 cps	overnight at 75°F followed by 1-2 hours at 150°F	70-80 Shore D	-60°F to +300°F	/de/tds/ep77m-1
EP77M-F Two component, silver conductive epoxy adhesive system Thermal Conductivity 10-12 BTU•in/(ft²•hr•°F) [1.44-1.73 W/(m•K)] Volume Resistivity 10⁻³ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	24 hours at 75°F	40-50 Shore D	-100°F to +250°F	/de/tds/ep77m-f
EP77M-FMed Two component, silver conductive epoxy adhesive system for medical applications Thermal Conductivity 10-12 BTU•in/(ft²•hr•°F) [1.44-1.73 W/(m•K)] Volume Resistivity 10⁻³ ohm-cm	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	24 hours at 75°F	40-50 Shore D	-100°F to +250°F	/de/tds/ep77m-fmed
EP79 Two component, room temperature curing epoxy for bonding, sealing and coating Tensile Modulus 300,000-350,000 psi Volume Resistivity <0.005 ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	flowable	overnight at 75°F followed by a post cure of 1-2 hours at 150-200°F	75-85 Shore D	4K to +275°F	/de/tds/ep79
EP79FL Two component, room temperature curing epoxy for bonding, sealing and coating Thermal Conductivity 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m•K)] Volume Resistivity <0.005 ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling	flowable	overnight at 75°F followed by a heat cure of 2-3 hours at 200°F	>50 Shore D	4K to +275°F	/de/tds/ep79fl
EP88FL Two component, room temperature curing epoxy for bonding, coating, sealing and potting Elongation 30-50% Refractive Index 1.51	RoHS Compliant	Bonding Sealing Coating Potting Gap Filling Encapsulation	800-1,200 cps	overnight at 75°F followed by 1 to 2 hours at 150°F to 200°F	45-55 Shore D	4K to 250°F	/de/tds/ep88fl
EP90FR-H Two component high strength epoxy system complying with FAR standard 14 CFR 25.853(a) for flame retardancy Dielectric Constant 4.4 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant FAR 25.853(a) for Flame Retardancy	Bonding Sealing Coating Potting Gap Filling Encapsulation Casting	20,000-50,000 cps	overnight at 75°F followed by 2-3 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/de/tds/ep90fr-h
EP90FR-HFL Two component toughened epoxy system complying with FAR standard 14 CFR 25.853(a) for flame retardancy Elongation 30-40% Volume Resistivity >10¹⁴ ohm-cm	FAR 25.853(a) for Flame Retardancy RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Potting Casting Gap Filling Encapsulation	3,000-10,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	25-45 Shore D	-60°F to +250°F	/de/tds/ep90fr-hfl
EP90FR-V Two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy also passes Boeing standard BSS 7238, Revision C for low smoke and BSS 7239, Revision A for toxicity Dielectric Constant 4.5 Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant Boeing Standards for Flame Retardancy FAR 25.853(a) for Flame Retardancy	Bonding Sealing Coating Potting Casting Encapsulation Gap Filling	20,000-40,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	>75 Shore D	-60°F to +250°F	/de/tds/ep90fr-v
EP93AOFR Two component thermally conductive flame retardant epoxy system that complies with FAR standard 14 CFR 25.853(a) for flame retardancy Thermal Conductivity 3.5-4.2 BTU•in/(ft²•hr•°F) [0.5-0.6 W/(m•K)] Volume Resistivity >10¹⁴ ohm-cm	FAR 25.853(a) for Flame Retardancy RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Casting Gap Filling	30,000-150,000 cps	overnight at 75°F followed by 3-4 hours at 150-200°F	80-85 Shore D	-80°F to +300°F	/de/tds/ep93aofr

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