Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21NS Two part, moderate viscosity, nanosilica filled epoxy system for bonding, sealing, coating and encapsulation Dielectric Constant 2.8 Refractive Index 1.55	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	50,000-90,000 cps	overnight at 75°F, followed by 4-5 hours at 150°F	75-85 Shore D	-80°F to +250°F	/de/tds/ep21ns
EP21QF Two component, room temperature curing epoxy featuring easy processing and good physical strength properties Dielectric Constant 3.4 Dielectric Strength >450 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	20,000-30,000 cps	1 hour at 65°C for 22 grams	75-85 Shore D	-80°F to +300°F	/de/tds/ep21qf
EP21SC-1 Two component epoxy resin system for bonding, coating and sealing Coefficient of Thermal Expansion 21-24 X 10⁻⁶ in/in/°C Volume Resistivity >10¹⁴ ohm-cm	ASTM D4060-14 for Abrasion Resistance RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	overnight at 75°F plus 2-3 hours at 150-200°F	90-95 Shore D	-60°F to +250°F	/de/tds/ep21sc-1
EP21TDC Versatile, toughened two component epoxy for bonding, sealing and coating T-peel Strength 20-30 pli Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Gap Filling Encapsulation	Part A: 11,000-16,000 cps, Part B: 70,000-140,000 cps	overnight at 75°F, followed by 1-2 hours at 150-200°F	>60 Shore D	-100°F to +250°F	/de/tds/ep21tdc
EP21TDC-2 Two component, highly flexibilized epoxy resin compound Elongation >120% T-peel Strength >30 pli	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 10,000-20,000 cps, Part B: 150,000-300,000 cps	overnight at 75°F followed by 2-3 hours at 150-200°F	75-80 Shore A	4K to +250°F	/de/tds/ep21tdc-2
EP21TDC-2AO Two component, room temperature curing, thermally conductive, electrically insulative epoxy system Elongation 50-100% T-peel Strength 10-20 pli	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 30,000-80,000 cps, Part B: 300,000-600,000 cps	overnight at 75°F, followed by 2-4 hours at 150-200°F	30-40 Shore D	4K to +250°F	/de/tds/ep21tdc-2ao
EP21TDC-2AOLV Two component, room temperature curing, thermally conductive, electrically insulative epoxy system Elongation 50-100% T-peel Strength 10-20 pli	RoHS Compliant	Bonding Sealing Gap Filling Encapsulation Coating	Part A: 1,000-5,000 cps, Part B: 300,000-600,000 cps	75°F: 48-72 hours; 200°F: 2-3 hours	30-40 Shore D	4K to +250°F	/tds/ep21tdc-2aolv
EP21TDC-2LOND Two component, highly flexibilized epoxy resin compound Tensile Modulus 2,000-7,000 psi Volume Resistivity >10¹³ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation	paste	75°F for 48-72 hours, 200°F for 2-3 hours	30-40 Shore D	4K to +250°F	/de/tds/ep21tdc-2lond
EP21TDC-2ND Two component, highly flexibilized, non-drip epoxy resin compound Dielectric Constant 3.6 Elongation >120%	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: paste	overnight at 75°F followed by 2-3 hours at 150-200°F	70-80 Shore A	4K to +250°F	/de/tds/ep21tdc-2nd
EP21TDC-4 Two component, highly flexibilized epoxy for bonding, sealing and coating Elongation 100-150% Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: 9,000-14,000 cps, Part B: 200,000-300,000 cps	12 hours at 75°F followed by 3-5 hours at 140-160°F	75-85 Shore A	-100°F to +250°F	/de/tds/ep21tdc-4

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