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| White Paper: Potting Compounds Protect Electronic Circuits |
Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. Learn about the performance properties of these systems, to uncover the best fit for the design and assembly of your electronic device.
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| Two Part Epoxy with Very Low Exotherm |
EP21LVSP6 is a two component system that is well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed viscosity of 4,000-6,000 cps and excellent electrical insulation properties. Additionally it features a very low exotherm and can be used for casting deep cross-section thicknesses. EP21LVSP6 has superior physical strength and chemical/water resistant characteristics.
For more information, request a technical data sheet on EP21LVSP6 |
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| Flowable, No-Mix LED Curable Polymer System |
Featuring breakthrough LED curing technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured, it has impressive physical properties, including outstanding dimensional stability, very good electrical insulation, optical clarity and commendable chemical resistance. Since LED light sources do not generate as much heat as UV ones, LED401LV can be used to bond heat sensitive substrates.
For more information, request a technical data sheet on LED401LV |
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| Thermally Conductive, Electrically Insulative Epoxy |
EP112FLAO-1 is a flexibilized epoxy designed for high performance electrical and electronic applications where good thermal conductivity and electrical isolation is required. This low viscosity, two part system has a long working life and cures readily at elevated temperatures to a tough strong solid with heat resistance up to 500°F. It also offers high dimensional stability, thermal shock/vibration resistance, excellent adhesion to a wide variety of substrates and is NASA low outgassing certified.
For more information, request a technical data sheet on EP112FLAO-1 |
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| Flexible, Heat Dissipative Silicone Withstands Up To 400°F |
MasterSil 151AO is a two component, low viscosity silicone compound for high performance potting and encapsulation. It combines high temperature resistance, superior flexibility, outstanding thermal conductivity and thermal cycling resistance. This addition cured silicone system cures readily at room temperature and does not require air for complete cross-linking.
For more information, request a technical data sheet on MasterSil 151AO |
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Copyright  2017 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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June 2017
