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| Updated Catalog: Adhesives, Sealants & Coatings for the Electronic Industry |
This 36-page catalog has been recently updated to include the latest developments to Master Bond’s extensive line of epoxies, silicones, polyurethanes, silicate based systems, light curing compounds and film adhesives. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, flip-chip and wire bonding applications.
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| Toughened, One Part Epoxy for Microelectronic Assembly |
Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of thermal cycling. This fast curing system has a paste consistency that flows slightly while curing. Supreme 3HTND-2CCM passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications.
For more information, request a technical data sheet on Supreme 3HTND-2CCM |
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| Electrically Insulative, Optically Clear Two Component Silicone |
Addition cured, MasterSil 971-LO does not require air for curing and will crosslink in sections thicker than 1 inch. Handling for this compound is user friendly; its mix ratio is one to one by weight and its working life is a convenient 3-4 hours. This NASA low outgassing approved system meets ASTM E595 specifications and has good tensile lap shear strength and tensile strength properties. Elongation is 100-150%. It also is a first class electrical insulator.
For more information, request a technical data sheet on MasterSil 971-LO |
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| Urethane Modified Epoxy Gel is Thermally Conductive |
Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 combines easy handling and curing properties, making it ideal for the encapsulation of sensitive electronic parts.
For more information, request a technical data sheet on Super Gel 9AO |
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
June 2016
