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| White Paper: Understanding Low Outgassing Adhesives |
Many high technology products and manufacturing processes can be sensitive to outgassed chemical compounds. Get to know the instances when only a NASA low outgassing approved system will do, and when “generic adhesives” with inherent low outgassing levels can get the job done. This white paper provides engineers a guide to understanding when low outgassing adhesives are the right choice.
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| High Viscosity UV Compound Passes NASA Low Outgassing Tests |
UV10TKLO-2 is a special one component, optically clear UV curable epoxy modified system for high performance bonding, sealing and encapsulation. This system can be cured up to 1/16 of an inch and can be easily “layered” to higher levels. Most significantly, its low outgassing properties enable this UV product to be used in a wide array of optical, electro-optical and vacuum applications that until now have been “off limits” for UV curable epoxies. It also withstands harsh chemical exposure and exhibits exceptional thermal stability.
For more information, request a technical data sheet on UV10TKLO-2 |
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| Flexible, Thermally Conductive Epoxy |
EP21TDC-2LO is a room temperature curing, flexibilized adhesive, sealant and encapsulant. This unique compound has superior shear and peel strength properties. It has a Shore D hardness of 30-40 and offers remarkable resistance to chemicals, thermal shock and impact. The hardened system is an excellent electrical insulator. NASA low outgassing approved, EP21TDC-2LO has been successfully employed in a number of cryogenic applications.
For more information, request a technical data sheet on EP21TDC-2LO |
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| Exceptional Chemical & Heat Resistant to 650°F |
Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225°C. It has outstanding resistance to many chemicals such as acids, bases, salts, fuels, oils and many solvents even at elevated temperatures. Additionally, exotherm upon cure is extremely low. EP17HT-LO also has excellent compressive/tensile strength properties.
For more information, request a technical data sheet on EP17HT-LO |
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| Thermally Conductive Epoxy Passes ASTM E595 Tests |
Combining impressive thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] with superb electrical insulation properties EP21AOLV-2LO is ideal for potting, bonding, sealing and coating applications. In fact, it can be used in large volume potting applications because it has low exotherm when curing and good flow properties. This NASA low outgassing certified system has a low coefficient of thermal expansion, enhanced dimensional stability, a high tensile modulus and first rate compressive strength properties.
For more information, request a technical data sheet on EP21AOLV-2LO |
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| Flowable, One Component Silicone System |
MasterSil 921-LO offers good adhesion to a wide variety of substrates including metals, composites, ceramics, glass as well as many rubbers and plastics. This one part neutral curing, non-corrosive silicone has a flowable, moderate viscosity that enables it to be well suited for smaller potting and encapsulation applications. Its lower durometer of 25-35 Shore A hardness facilitates its use with sensitive electronic/optical components. Additionally, MasterSil 921-LO passes NASA low outgassing test requirements and resists from -175°F to +500°F.
For more information, request a technical data sheet on MasterSil 921-LO |
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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September 2016
