|
Protecting Chip on Board (COB) Devices with Glob Top Encapsulants |
Glob top encapsulations are typically selected for consumer and industrial electronic applications involving chip protection without damaging fragile wires. These systems are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals, thermal conductivity and more in targeted areas.
Download the full white paper
|
| Flip Chip Assemblies with Underfill Encapsulants |
Underfill encapsulants are carefully formulated to ensure flowability, an acceptable coefficient of thermal expansion and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.
Download the full white paper
|
| Conformal Coatings for Reliable Electronic Assemblies |
Conformal coatings act as a barrier between electronic circuits and the environment, protecting all the areas they cover against contaminants while strengthening delicate components. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.
Download the full white paper
|
|
|
|
Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
|
|
View this email online
September 2018
