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Conductive epoxies offer numerous advantages over traditional tin/ lead soldering for electronic component applications, including improved safety and a lower environmental impact. This tech tip explains some of the issues related to lead soldering and how electrically conductive epoxies are an attractive alternative for making challenging electronic connections.
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EP3HTS-LO: One Part Epoxy Meets NASA Low Outgassing Specifications |
Silver filled EP3HTS-LO combines easy handling with impressive strength properties. It adheres well to a wide variety of substrates including metals, composites, ceramics, glass and many plastics. This system features exceptionally low volume resistivity of less than 1 milliohm-cm. EP3HTS-LO has a smooth paste consistency and is serviceable over the wide temperature range of -60°F to +400°F.
For more information, request a technical data sheet on EP3HTS-LO
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| EP21TDCSFL: Two Part Epoxy Adhesive Has Low Volume Resistivity |
Electrically conductive EP21TDCSFL features high bond strength and outstanding resistance to thermal cycling. Its high flexibility and low shrinkage produce very little stress on sensitive components and substrates. This easy to handle system can be easily applied, has superb flow properties and cures at ambient temperatures. Serviceable from 4K to +250°F, EP21TDCSFL can function even in cryogenic conditions.
For more information, request a technical data sheet on EP21TDCSFL
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| Supreme 10HTS: One Part, Silver Conducive Epoxy Is NASA Approved |
Supreme 10HTS features a combination of high performance properties including high shear peel strength, low volume resistivity, and exceptionally easy processing. This one part system is ideal for applications that turn up the heat since it resists temperatures over 400°F. As a toughened system, it offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking.
For more information, request a technical data sheet on Supreme 10HTS
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| EP77M-F: Rapid Setting Silver Conductive Epoxy Adhesive |
Master Bond EP77M-F delivers a very low volume resistivity of <0.001 ohm-cm. Unlike the majority of two part, silver conductive epoxy systems, EP77M-F has a convenient, one to one mix ratio, by weight or volume. This smooth paste will set up at ambient temperatures within 5-7 minutes even when mixed in very small amounts. Full cures usually take about 8-12 hours at room temperature.
For more information, request a technical data sheet on EP77M-F
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Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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February 2018
