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EP30Med: Low Viscosity Epoxy Meets USP Class VI Specifications |
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Ideal for encapsulation, bonding and sealing applications, Master Bond EP30Med offers excellent electrical insulation properties and exceptionally low shrinkage upon cure. It is a two component, room temperature curing biocompatible epoxy adhesive designed for high performance medical device applications. It features high bond strength, superior durability, outstanding resistance chemicals as well as cold sterilants, EtO and gamma radiation. It also meets FDA requirements for indirect food contact as per FDA CFR 175.105.
For more information, request a technical data sheet on EP30Med
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MB600G: Electrically Conductive, High Temperature Resistant Coating |
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Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost effectiveness. MB600G is serviceable over the remarkably wide temperature range of 0°F to +700°F.
For more information, request a data sheet on MB600G
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EP30LTE-LO: NASA Low Outgassing Certified Two Component Epoxy |
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Featuring a remarkably low coefficient of thermal expansion of 15-18 x 10-6 in/in/°C, EP30LTE-LO can be used in bonding, coating, sealing and encapsulation applications. Additionally, it has very good thermal conductivity and is highly electrically insulative. NASA low outgassing approved, EP30LTE-LO is also noteworthy for its high bond strength, superior dimensional stability and good flow properties.
For more information, request a data sheet on EP30LTE-LO
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MasterSil 713: Low Viscosity, One Component Fast Curing Silicone |
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Ideal for smaller encapsulations and conformal coating applications, MasterSil 713 is an easy to use one component silicone with an exceptionally low viscosity. This self leveling system cures rapidly at room temperature and is non-corrosive. Speed of cure depends upon the level of humidity and the thickness of the layer being cured. It can be cured in thicknesses up to ¼ inch deep with superb flexibility and elasticity. MasterSil 713 also offers outstanding electrical insulation properties and is serviceable up to +400°F.
For more information, request a data sheet on MasterSil 713
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Supreme 11ANHT: Thermally Conductive, Electrically Insulative System |
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High strength Supreme 11ANHT is an easy to handle two part epoxy paste with a one to one mix ratio by weight or volume that cures at room temperature. It resists temperatures up to 350°F and offers excellent adhesion to metals, ceramics, glass, vulcanized rubbers as well as many plastics. This toughened compound withstands rigorous thermal cycling.
For more information, request a data sheet on Supreme 11ANHT
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UV22: Nanosilica Filled Epoxy Has High Dimensional Stability |
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With superb optical clarity and abrasion resistance, UV22 will cure quickly and easily when exposed to a UV light source. Cationic cure systems, such as UV22, tend to have much higher temperature resistance than other UV type systems. Its glass transition temperature (Tg) with a straight UV cure is 100°C, and when post cured for 30 minutes at 125-150°C, the Tg is 135°C. It also has exemplary low shrinkage properties, linearly less than 1%. UV22 is nanosilica filled and offers superior adhesion to glass, ceramics, metals and most plastics.
For more information, request a data sheet on UV22
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 newsletters@masterbond.com
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
May 2016
