MasterSil 800: Silicone system is serviceable up to 300°C |
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Featuring unsurpassed thermal stability, MasterSil 800 is serviceable at temperatures as high as 300°C. This one part, high performance, non-corrosive silicone is low in viscosity making it free flowing and self leveling. It is ideal for bonding, sealing, protective coatings, encapsulating and creating formed-in-place gaskets.
For more information, request a technical data sheet on MasterSil 800
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EP51M: Sets up in just 3 minutes at room temperature |
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EP51M epoxy system is fast curing making it ideal for high speed production line assembly bonding operations. It produces durable and strong bonds that are resistant to thermal cycling and a variety of chemicals. Serviceable from 4K to 250°F, EP51M bonds well to dissimilar substrates. With a convenient one to one mix ratio, it is also easy to use.
For more information, request a data sheet on EP51M
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EP21AOLV-2Med: Thermally conductive medical grade epoxy |
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Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.
For more information, request a data sheet on EP21AOLV-2Med
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EP19HT: One part epoxy for impregnation applications |
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Featuring superior flow properties, Master Bond EP19HT is ideal for high performance impregnation and coating applications with an exceptionally low viscosity of 300-700 cps. It has a remarkable strength profile and adheres well to a variety of substrates such as ceramics, metals, composites, glass and many plastics. This compound is also serviceable over the wide temperature range of -60°F to +400°F. Chemical resistance properties are our outstanding.
For more information, request a data sheet on EP19HT
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EP21TPND: Exceptional resistance to fuels and oils |
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Unlike many chemical resistant materials, EP21TPND has excellent toughness and flexibility enabling it to resist rigorous thermal cycling as well as mechanical and thermal shocks. It can withstand exposure to a number of chemicals including water, gasoline, fuels, oils, hydrocarbons, hydraulic fluids, acids and bases. This epoxy polysulfide has a non-drip consistency and is widely used in the aerospace, OEM, electronic, electrical, chemical and related industries.
For more information, request a data sheet on EP21TPND
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LED401: Moderate viscosity LED curable compound |
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LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated during the cure cycle. Additionally, LED401 is easy to apply, has exceptional water and moisture resistance and is tack free.
For more information, request a data sheet on LED401
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