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UV15DC80Med: UV & Heat Curable, Medical Grade Epoxy System |
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UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat cure that can be initiated at the low temperature of 80°C. This adhesive allows for curing areas on parts that do not allow UV light curing because of “shadowing” issues. It also meets USP Class VI specifications and passes ISO 10993-5 cytotoxicity testing. UV15DC80Med has very good temperature resistance along with the ability of withstanding many chemicals including liquid sterilants, radiation and even autoclaving. It requires no mixing, is solvent free and exhibits excellent physical strength properties.
For more information, request a technical data sheet on UV15DC80Med
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FL901S: Electrically Conductive, Silver Filled Adhesive Film |
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High performance silver filled epoxy adhesive film, FL901S features outstanding electrical conductivity, superior mechanical strength and first rate chemical resistance properties. It cures quickly at moderate temperatures and can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Preformed shapes are available upon request. FL901S is also a superb thermal conductor and cures in a manner that ensures uniform bond line thickness.
For more information, request a data sheet on FL901S
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MasterSil 156: Thermally Conductive & Passes UL 94V-0 Testing for Flame Retardancy |
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Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU•in/ft²•hr•°F [1.15-1.29 W/(m•K)]. This system also passes UL 94V-0 testing for flame retardancy.
For more information, request a data sheet on MasterSil 156
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EP30LP-2: Low Viscosity, Optically Clear Epoxy Compound |
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Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F.
For more information, request a data sheet on EP30LP-2
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Supreme 33CLV: High Strength, Room Temperature Curing Epoxy Possesses Thermal Stability |
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Toughened Supreme 33CLV is an innovative system that features exceptionally high temperature resistance over the wide service temperature range of -100°F to +450°F. It offers superior resistance to vibration, impact and thermal cycling. Widely used in the electronic, electrical, aerospace and OEM type industries, this product exhibits excellent dimensional stability, withstands exposure to many aggressive chemicals and has outstanding electrical insulation properties.
For more information, request a data sheet on Supreme 33CLV
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EP38CL: Toughened, Electrically Insulative Epoxy System |
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With a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D scale.
For more information, request a data sheet on EP38CL
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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February 2016
