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January 2018 |
EP21LVSP6 is well suited for potting and encapsulation application as it has a desirable combination of a long open time, low viscosity and excellent electrical insulation properties. It also features a very low exotherm and can be used for casting in deep cross-section thicknesses. This two component epoxy is formulated to cure at room temperature and bonds well to a wide variety of substrates. 
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| Some additional key properties include: |
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| For more information, request at technical data sheet on EP21LVSP6 |
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Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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