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June 2019 |
This toughened, one component system is formulated to cure at the lower temperature of 85°C, which is ideal for sensitive electronic parts. It is well suited for glob top, bonding, sealing, coating, and small encapsulations. This system offers excellent thermal conductivity and electrical insulation. 
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+1 201 343 8983
2019 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
