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January 2018 |
Flip through five of our top performing systems featuring low coefficients of thermal expansion. These systems are well suited for a variety of bonding, sealing, coating and encapsulation applications and offer a variety of superior properties.
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EP42HT-3AO: Room Temperature Curing Epoxy Is Thermally Conductive & Electrically Insulative
EP13LTE: One Part Epoxy Is Well Suited for Structural Bonding Applications EP42HT-2LTE: Two Part System Offers Exceedingly Low Shrinkage upon Cure EP30LTE-2: Dimensionally Stable Epoxy with Good Flow Properties EP21TCHT-1: Exceptionally Wide Service Temperature Range of 4K to 400°F |
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Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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