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May 2018
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For applications where thermal conductivity is essential, Master Bond offers a variety of adhesive systems that include special fillers to enhance this property and can be applied in thin bond lines. Select formulations also deliver exceptionally low thermal resistance. Our thermally conductive compounds also feature wide service temperature ranges, excellent electrical properties and high strength values. Some of our standout adhesives for heat transfer are now available in an easy to browse digital brochure.
Products included in the brochure: Supreme 18TC: Epoxy meets NASA low outgassing specifications EP30TC: Low thermal resistance, room temperature curing epoxy EP3HTSDA-2: One part epoxy offers excellent electrical conductivity and remarkably low thermal resistance MasterSil 151TC: Highly flexible addition cured silicone offers low thermal resistance EP3UF: System is ideal for underfill applications EP48TC: Two component epoxy with ultra low thermal resistance |
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Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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