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September 2019
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Sensitive electronic components mounted on a circuit board often require protection from exposure to harsh environments. While there are several ways to accomplish this, the dam and fill method offers many benefits. In this video, learn how a damming compound such as Supreme 3HTND-2DM-1 can create a barrier around the component, while the flowable filler material, EP3UF-1, completely covers the component for protection. 
Supreme 3HTND-2DM-1: Toughened, one part epoxy features a non-drip consistency and fast curing EP3UF-1: Single component, thermally conductive system with a fine particle size and low viscosity |
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Copyright  2019 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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