News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part 300°C Rated Silicone Passes Non-Cytotoxicity Standards Release Date: 11/19/2025 Product: MasterSil 800Med MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming its suitability for use in medical device applications. The material is non-corrosive and possesses excellent flow properties, making it ideal for… Read More...
	Nanosilica Filled, Dual Curable Adhesive Offers Rapid Fixturing with LED Light Release Date: 09/22/2025 Product: LED422DC90 Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique "side-bonding" capability allows for rapid polymerization up to 3-4 mm in depth by exposing the adhesive to 405 nm LED light from an angle. The cure is then… Read More...
	One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard Release Date: 05/19/2025 Product: EP3HTSDA-2Med Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver filled system, it exhibits high electrical conductivity (volume resistivity… Read More...
	Toughened, UV Curable Adhesive Features Optical Clarity Release Date: 04/22/2025 Product: UV15-7HP Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm² using a UV light source emitting at a wavelength of 320-365 nm. The material… Read More...
	Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation Release Date: 03/24/2025 Product: EP29LPSPND-3 Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures… Read More...