News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Room Temperature Curing, Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance Release Date: 09/07/2010 Product: EP30D-7 Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer,… Read More...
	Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability Release Date: 08/12/2010 Product: EP30FLAO Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It… Read More...
	New Chemically Resistant Electrically Insulative Structural Adhesive with Exceptional Strength Properties Release Date: 07/20/2010 Product: EP31 For superb adherence to a wide variety of substrates including many metals, plastics, rubbers, ceramics and glass, Polymer System EP31 was developed by Master Bond Inc. This two part system features extraordinary adhesion with a lap shear strength exceeding 4,600 psi, a peel strength surpassing 40 pli, a tensile modulus of more… Read More...
	One Part High Strength Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specifications Release Date: 06/08/2010 Product: Supreme 10AOHT-LO Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and… Read More...
	Single Component Snap Cure Epoxy Has Outstanding Electrical Properties and Chemical Resistance Release Date: 05/06/2010 Product: EP17HT-3 Master Bond EP17HT-3 is a one part epoxy that sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250°F-300ºF. As a one part system, no mixing is required and the epoxy can be cured in sections up to 1/4" thick. Moreover, its working life is indefinite as it will not gel until heated above 200ºF. With a… Read More...