News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test Release Date: 02/25/2019 Product: EP93AOFR Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K… Read More...
	Biocompatible, Nanosilica Filled LED Curable Adhesive Release Date: 01/28/2019 Product: LED405Med Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer. “LED405Med has a nanosilica filler… Read More...
	Low Viscosity, Thermally Conductive Underfill Epoxy Release Date: 01/07/2019 Product: EP3UF-1 Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,… Read More...
	Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance Release Date: 12/18/2018 Product: MasterSil 980 Master Bond MasterSil 980 is two part fluorosilicone system for high performance bonding, sealing, coating and potting applications. It withstands harsh chemicals such as gasoline, diesel fuel, motor oil, ethanol and many solvents. After testing, chemical resistance for MasterSil 980 was far superior when compared to standard… Read More...
	One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications Release Date: 11/26/2018 Product: EP17HTND-CCM Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets… Read More...