News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: EP4S-80

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI…

Release Date:
Product: EP40TC

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler…

Release Date:
Product: EP62-1HTMed

Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.

“This product resists…

Release Date:
Product: LED405FL3

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection…

Release Date:
Product: EP5G-80

Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and…