News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	New Highly Flexible Silver Conductive Epoxy Adhesive Release Date: 10/05/2007 Product: EP21TDCSFL Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more… Read More...
	New Flexible Low Viscosity Silicone Compound Release Date: 08/30/2007 Product: MasterSil 151 MasterSil 151 is a new two component, low viscosity silicone compound for high performance casting, potting and encapsulation introduced by Master Bond Inc., Hackensack, N.J. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. MasterSil 151 has superior electrical insulation… Read More...
	Epoxy Cures at Low Temperature Release Date: 07/26/2007 Product: EP27 Achievement of high performance cures at low temperatures has long been a problem for epoxy resin compositions. Master Bond Inc. has successfully overcome this problem with a newly developed epoxy resin system called Master Bond EP27. In 6 mil thick films, EP27 will set in as little as 2 hours at only 40°F and will cure in 48-… Read More...
	Master Bond Introduces Flexible Epoxy Resin Compound EP40 with Unexcelled Shear/Peel Strength for High Performance Bonding, Sealing and Casting to Engineering Plastics Particularly Polycarbonates and Acrylics As Well As To Metals Release Date: 04/03/2007 Product: EP40 Master Bond has successfully developed a new, highly flexible two component epoxy resin compound called EP40 which features outstanding shear and peel strength and is especially designed for bonding, sealing and casting engineering plastics and metals. This compound has been formulated to cure readily at ambient or more quickly… Read More...
	Adhesive resists up to 400°F Release Date: 01/05/2007 Product: EP21HT Master Bond Inc., Hackensack, N.J. is proud to announce the development of a new two component, room temperature curing epoxy adhesive called EP21HT. This system is easy to use and has a convenient, forgiving 1 to 1 mix ratio by weight or volume. EP21HT is 100% reactive and contains no solvents or volatiles. It has excellent… Read More...