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Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP17HTND-2 One component, high temperature resistant epoxy system for bonding, sealing and coating with a paste consistency Glass Transition Temperature (Tg) 200-210°C Tensile Lap Shear Strength 2,900-3,100 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Gap Filling	paste	6-8 hours at 300°F followed by a post cure of 6-12 hours at 350°F	80-90 Shore D	-80°F to +600°F	/it/tds/ep17htnd-2
EP17HTND-CCM One component, high temperature resistant epoxy system for bonding and sealing Glass Transition Temperature (Tg) 160-165°C Tensile Lap Shear Strength 2,400-2,600 psi	NASA Low Outgassing RoHS Compliant	Bonding Sealing Encapsulation Coating	Paste	Typical curing schedules are 2 hours at 300°F or 1-2 hours at 350°F.	80-90 Shore D	-80°F to +550°F	/it/tds/ep17htnd-ccm
EP17HTS-DA One component, high temperature resistant, electrically conductive, die attach epoxy Glass Transition Temperature (Tg) 125-135°C Volume Resistivity <0.005 ohm-cm	MIL-STD-883J for Thermal Stability NASA Low Outgassing RoHS Compliant	Bonding Die Attach Sealing Coating Gap Filling	paste	1 hour at 180°F, followed by 2-3 hours at 300°F with a post cure of 1-2 hours at 350°F.	75-85 Shore D	-80°F to +550°F	/it/tds/ep17hts-da
EP17TF One component, toughened epoxy system for bonding, sealing and coating Elongation 5-10% Tensile Lap Shear Strength 8,000-9,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	paste	5-6 hours at 300°F followed by a post cure of 4-5 hours at 350°F	85-95 Shore D	-150°F to +550°F	/it/tds/ep17tf
EP19HT One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Glass Transition Temperature (Tg) 120-125°C	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Impregnation	300-700 cps	1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F.	80-90 Shore D	-60°F to +400°F	/it/tds/ep19ht
EP19HTFL One component epoxy system for impregnation, lamination, sealing and coating Glass Transition Temperature (Tg) 125-130°C Tensile Modulus >300,000 psi	RoHS Compliant	Sealing Coating Impregnation	300-700 cps	1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F	>65 Shore D	-60°F to +350°F	/it/tds/ep19htfl
EP19HTLV One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Coating Impregnation	300-800 cps	Optimum curing schedule is 1 hour at 250°F followed by a post cure of 1-2 hours at 300-350°F.	>65 Shore D	-60°F to +400°F	/it/tds/ep19htlv
EP19HTLV-2 One component epoxy system for impregnation, lamination, sealing and coating Dielectric Constant 3.6 Glass Transition Temperature (Tg) 125-130°C	RoHS Compliant	Bonding Sealing Coating Impregnation	200-700 cps	Curing schedule options include 250°F for 60-90 minutes or 300°F for 45-60 minutes.	>65 Shore D	-60°F to +400°F	/it/tds/ep19htlv-2
EP21LV3/5Med Two part epoxy system for medical and related applications featuring superior toughness Dielectric Constant 3.15 Tensile Lap Shear Strength 1,000-1,200 psi	FDA Food Grade 21 CFR 175.105 RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Gap Filling	10,000-14,000 cps	75°F: 2-3 days, 200°F: 3 hours	60-70 Shore D	-80°F to +250°F	/it/tds/ep21lv35med
EP36 One component, B-staged epoxy for potting, encapsulation, coating and bonding Glass Transition Temperature (Tg) 95-100°F [35-37.8°C] Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant	Bonding Coating Encapsulation Potting Gap Filling	80,000-120,000 cps	350°F for 2-3 hours	80 Shore D	-100°F to +500°F	/it/tds/ep36

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