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Product Certifications Applications Viscosity Cure Schedule Hardness Temp. Range Link to Content
EP62-1LPSPMed Two Component Epoxy
EP62-1LPSPMed
Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation
Glass Transition Temperature (Tg)
80-85°C
Volume Resistivity
>10¹⁴ ohm-cm
  • ISO 10993-5 for Cytotoxicity
  • USP Class VI Medical
  • 1,000 Hours at 85°C/85% RH
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Encapsulation
  • Impregnation
  • Potting
  • Underfill
150-300 cps 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C, or 30-60 minutes at 125°C 75-85 Shore D 4K to +400°F /it/tds/ep62-1lpspmed
Two Part Epoxy EP62-1LPSPMed White
EP62-1LPSPMed White
Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation
Dielectric Constant
4.6
Glass Transition Temperature (Tg)
80-85°C
  • ISO 10993-5 for Cytotoxicity
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Impregnation
  • Encapsulation
  • Potting
  • Gap Filling
150-300 cps Overnight at 75°F followed by either 8-10 hours at 60-70°C, 60-90 minutes at 80-100°C, or 30-60 minutes at 125°C. Post curing at 110-135°C for 2-4 hours will help optimize properties. 75-85 Shore D 4K to +400°F /it/tds/ep62-1lpspmed-white
EP62-1Med Two Component Epoxy System
EP62-1Med
Two component, biocompatible epoxy compound
Dielectric Constant
4.3
Volume Resistivity
>10¹⁴ ohm-cm
  • ISO 10993-5 for Cytotoxicity
  • USP Class VI Medical
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
4,000-8,000 cps Typical cure schedules range from 4-6 hours at 60-70°C, 20-40 minutes at 80-100°C or 10 minutes at 125°C. 80-90 Shore D -60°F to +450°F /it/tds/ep62-1med
Two Part Epoxy System EP64
EP64

Two component, vacuum compatible epoxy with convienent handling featuring outstanding temperature and chemical resistance

Glass Transition Temperature (Tg)
210-215°C
Volume Resistivity
>10¹⁴ ohm-cm
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
50,000-90,000 cps 80–90°C for 4–6 hours, followed by a post cure at 120–130°C for 2–4 hours 80-90 Shore D -60°F to +450°F [-51°C to +232°C] /it/tds/ep64
Two Part Epoxy System EP64Med
EP64Med

Two component, medical grade epoxy with convienent handling featuring outstanding temperature and chemical resistance

Glass Transition Temperature (Tg)
210-215°C
Volume Resistivity
>10¹⁴ ohm-cm
  • RoHS Compliant
  • ISO 10993-5 for Cytotoxicity
  • Bonding
  • Sealing
  • Coating
50,000-90,000 cps 80-90°C for 4-5 hours, followed by a post cure at 120-130°C for 2-3 hours 80-90 Shore D -60°F to +450°F [-51°C to +232°C] /it/tds/ep64med
EP65 Two Component Epoxy
EP65
Two component epoxy system featuring fast setup time and good temperature resistance
Dielectric Constant
4.1
Tensile Lap Shear Strength
1,100-1,300 psi
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: 11,000-15,000 cps, Part B: 8,000-12,000 cps full cure generally occurs within 12-24 hours 75-85 Shore D -60°F to +300°F /it/tds/ep65
EP65HT Two Component Epoxy
EP65HT
Two component epoxy system featuring the special combination of fast setup times and high temperature resistance
Glass Transition Temperature (Tg)
125-130°C
Volume Resistivity
>10¹⁴ ohm-cm
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: 55,000-110,000 cps, Part B: 8,000-12,000 cps 10-15 minutes setup, full cure within 12-18 hours at 75°F 75-85 Shore D -60°F to +400°F /it/tds/ep65ht
EP70CN
Two component epoxy system for bonding, sealing, coating and potting featuring a natural curing agent
Tensile Strength
11,000-12,000 psi
Volume Resistivity
>10¹⁴ ohm-cm
  • NASA Low Outgassing
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation
  • Gap Filling
2,500-5,000 cps overnight at 75°F followed by 3-4 hours at 140-170°F 75-85 Shore D -100°F to +450°F /it/tds/ep70cn
EP75-1 Two Part Epoxy System
EP75-1
Two component, graphite conductive epoxy system for bonding, sealing, coating
Coefficient of Thermal Expansion
10-15 X 10⁻⁶ in/in/°C
Volume Resistivity
50-100 ohm-cm
  • RoHS Compliant
  • 1,000 Hours at 85°C/85% RH
  • NASA Low Outgassing
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: paste, Part B: 200-500 cps overnight at 75°F followed by 1-2 hours at 150-200°F 75-85 Shore D 4K to +250°F /it/tds/ep75-1
 EP76M Two Part Epoxy
EP76M
Two component, nickel filled epoxy for bonding, sealing and coating
Tensile Lap Shear Strength
>2,000 psi
Volume Resistivity
5-10 ohm-cm
  • RoHS Compliant
  • Bonding
  • Sealing
  • Coating
  • Gap Filling
Part A: >500,000 cps, Part B: >900,000 cps ambient temperatures in 3-5 days or at 200°F in 2-3 hours >80 Shore D -60°F to +250°F /it/tds/ep76m

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