Graphene Filled Epoxy System EP30NG Offers Unparalleled 5.5 W/(m•K) Thermal Conductivity

PERFORMANCE PROPERTIES


THERMAL CONDUCTIVITY

38.15 BTU•in/ft2•hr•°F
[5.5 W/(m•K)]

COMPRESSIVE STRENGTH

22,000-24,000 psi


VOLUME RESISTIVITY

100-200 ohm-cm


HARDNESS

85-95 Shore D


COEFFICIENT OF THERMAL EXPANSION

24-26 x 10-6 in/in/°C

SERVICE TEMPERATURE RANGE

-60°F to +300°F
[-51°C to +149°C]


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APPLICATION PROCESS


EP30NG is ideal for bonding flat surfaces or where contact pressure can be applied. Although the compound is graphene filled, the minimum bond line thickness is 0.18mm since, by nature, when graphene nanoparticles align they agglomerate to form particles sizes of 0.18mm.

PRODUCT ADVANTAGES



  • • Exceptionally high thermal conductivity
  • • High compressive strength
  • • Superior dimensional stability
  • • Low coefficient of thermal expansion
  • • Wide service temperature range
  • • Thick non-drip consistency


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