Graphene Filled Epoxy System EP30NG Offers Unparalleled 5.5 W/(m•K) Thermal Conductivity
PERFORMANCE PROPERTIES
THERMAL CONDUCTIVITY
38.15 BTU•in/ft2•hr•°F
[5.5 W/(m•K)]
COMPRESSIVE STRENGTH
22,000-24,000 psi
VOLUME RESISTIVITY
100-200 ohm-cm
HARDNESS
85-95 Shore D
COEFFICIENT OF THERMAL EXPANSION
24-26 x 10-6 in/in/°C
SERVICE TEMPERATURE RANGE
-60°F to +300°F
[-51°C to +149°C]
APPLICATION PROCESS
EP30NG is ideal for bonding flat surfaces or where contact pressure can be applied. Although the compound is graphene filled, the minimum bond line thickness is 0.18mm since, by nature, when graphene nanoparticles align they agglomerate to form particles sizes of 0.18mm.
PRODUCT ADVANTAGES
- • Exceptionally high thermal conductivity
- • High compressive strength
- • Superior dimensional stability
- • Low coefficient of thermal expansion
- • Wide service temperature range
- • Thick non-drip consistency
