One Part, 85˚C Curing Epoxy for Chip Coating Applications

PERFORMANCE PROPERTIES


THERMAL CONDUCTIVITY

5-10 BTU•in/ft2•hr•°F
[0.72-1.44 W/(m•K)]

TENSILE STRENGTH

2,000-3,000 psi


HIGH VOLUME RESISTIVITY

1014 ohm-cm


HARDNESS

75-85 Shore D


LAP SHEAR STRENGTH,
ALUMINUM TO ALUMINUM

500-600 psi

SERVICE TEMPERATURE RANGE

-100°F to +350°F
[-73°C to +177°C]


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APPLICATION PROCESS


While it is primarily used as a glob top material it also can be used for potting and bonding applications.
This epoxy is ideal for applications where heat curing above 200°F is not possible.

PRODUCT ADVANTAGES



  • • Cures at 175-185°F for 2 - 3 hours
  • • One part system – no mixing needed
  • • Thixotropic paste: 35,000 - 95,000 cps
  • • Very long open time
  • • Dispenses well for glob top applications
  • • Toughened, resists thermal cycling


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